The Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.
For Nettop and Netbook Atom Microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.
Nettop processors (small desktop)
Bonnell microarchitecture
"Diamondville" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading Transistors: 47 million Die size: 25.96 mm² (3.27 × 7.94) Package size: 22 mm × 22 mm
"Pineview" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller Transistors: 123 million (single-core), 176 million (dual-core) Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core) Package size: 22 mm × 22 mm
"Cedarview" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading (D2550, D2560, D2700, D2701 only) Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller Package size: 22 mm × 22 mm
Netbook processors (sub-notebook)
Bonnell microarchitecture
"Diamondville" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Transistors: 47 million Die size: 26 mm² Package size: 22 mm × 22 mm
"Pineview" (45 nm)
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB Transistors: 123 million (single-core), 176 million (dual-core) Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core) Package size: 22 mm × 22 mm
"Cedarview" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller Package size: 22 × 22 mm
MID processors/SoCs (UMPC/Smartphone/IoT)
Bonnell microarchitecture
"Silverthorne" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x Model Z515 supports Intel Burst Performance Technology Uses the Poulsbo chipset. Transistors: 47 million Die size: 26 mm² Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number)
"Lincroft" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT). GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor. Transistors: 140 million Die size: 7.34 mm × 8.89 mm = 65.2526 mm² Package size: 13.8 mm × 13.8 × 1.0 mm Steppings: C0
"Penwell" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading. Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller Package size: 12 mm × 12 × 1.0 mm
Silvermont microarchitecture
"Merrifield" (22 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT). Z3480 also supports Intel Wireless Display. Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5 Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
Package size: 12 mm × 12 × 1.0 mm
"Moorefield" (22 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Display. GPU (PowerVR G6430) and memory controller are integrated onto the processor die Package size: 14 mm × 14 × 1.0 mm
"SoFIA" (28 nm)