We present the results of x-ray measurements on a hybrid CMOS detector that uses a H2RG ROIC and a unique bonding structure. The silicon absorber array has a 36{ \mu}m pixel size, and the readout array has a pitch of 18{ \mu}m; but only one readout circuit line is bonded to each 36x36{ \mu}m absorber pixel. This unique bonding structure gives the readout an effective pitch of 36{ \mu}m. We find the increased pitch between readout bonds significantly reduces the interpixel capacitance of the CMOS detector reported by Bongiorno et al. 2010 and Kenter et al. 2005.
Categories: astro-ph.IM